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Fig. 4 | Journal of Solid State Lighting

Fig. 4

From: Optical role of die attach adhesive for white LED emitters: light output enhancement without chip-level reflectors

Fig. 4

Light output of BR-free emitters; Light output of (a) a blue LED and (b) a white LED emitters with BR-based and BR-free chip as a function of reflectance of the leadframe substrate (R LF ). Bondline thickness of the CDAA is 5 μm. Results are normalized by the light output of BR (R BR  = 98 %) based emitter at R LF of 98 %. Error estimated for the simulation is 0.814 %

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