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Fig. 1 | Journal of Solid State Lighting

Fig. 1

From: Optical role of die attach adhesive for white LED emitters: light output enhancement without chip-level reflectors

Fig. 1

Leadframe based LED emitter; (a) Schematic cross section of a packaged LED emitter by using optically clear die attach adhesive (CDAA), (b) optical model used in Monte-Carlo simulations and (c) microscopic enlargement of the blue LED chip attached on the leadframe substrate by using CDAA. Layers are not plotted in their relative thickness in order to present illustration. The size of the chip is 24 × 24 mil (0.61 × 0.61 mm) and the thickness is about 100 μm

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